India’s Semiconductor Vision for 2035:
NITI Aayog’s Frontier Tech Hub (FTH) released the report, “Future of India’s Semiconductor Industry”, outlining India’s Semiconductor Vision 2035 and a strategic roadmap to transform the country into a globally indispensable semiconductor nation.
- It arrives at a critical juncture with the Union Budget 2026 announcing ISM 2.0 (India Semiconductor Mission 2.0), signalling a decisive shift from ecosystem initiation to ecosystem deepening.
- India’s Semiconductor Vision 2035 aims to build a USD 120–150 billion semiconductor value chain, achieve greater self-reliance, emerge as a global leader in chip design, OSAT, and advanced packaging, and become a key supplier of SiC and GaN materials.
- To achieve this vision, India will leverage its 5P Strategy (Pioneering, Policy & Investment, Production, People, and Partnership) while addressing challenges related to technology, talent, capital, and infrastructure, and focusing on opportunities such as AI chip design, advanced packaging, compound semiconductors, and quantum technologies.
- India’s Semiconductor Vision for 2035: India aims to build a USD 120–150 billion semiconductor value chain by 2035, anchored in three pillars:
- Strategic Self-sufficiency: Dominate mature and compound semiconductor nodes and selectively pursue advanced nodes.
- Ecosystem Strength: Emerge as a global leader in chip design, Outsourced Semiconductor Assembly and Test (OSAT), and advanced packaging.
Global Indispensability: Become a trusted supplier of wide-bandgap materials (Gallium Nitride (GaN) and Silicon Carbide (SiC) chips) that global supply chains cannot do without. - Key Quantified Targets by 2035: Capture 10–13% of the global semiconductor chip market.
Become a top-3 global destination for OSAT and advanced packaging. - Achieve chip self-sufficiency of 35–50% of domestic demand (up from 15–25% by 2030).
- Retain 55–70% of value in every chip consumed in India (through design, packaging, or materials).
- Create 100+ advanced IPs in AI, quantum, and High-performance computing (HPC) chip design.
- Export chips for affordable 5G/6G phones, edge CPUs, microcontrollers, and sensors to 50+ nations.
- Become the top global supplier of wide-bandgap materials (SiC and GaN).
